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Simulating a 1550 nm InGaAs/InP PIN Photodiode

In this tutorial we simulate a PIN photodiode made from indium gallium arsenide (InGaAs) and indium phosphide (InP). The device is designed for near-infrared detection at 1550 nm, a wavelength widely used in optical-fibre communications. We will examine how light is absorbed in the InGaAs layer, how the built-in and applied electric fields separate photogenerated electrons and holes, and how these processes determine the measured current under reverse bias.

The simulation combines a wavelength-dependent optical calculation with electrical drift–diffusion transport. In addition to obtaining current–voltage (J–V) characteristics, we will inspect the energy-band diagram and the spatially resolved carrier generation rate. The aim is to connect the output of the numerical model to the operation of a real photodiode.

OghmaNano model of a layered InP/InGaAs PIN photodiode
The InGaAs/InP PIN photodiode used in this tutorial. A narrow-bandgap InGaAs absorber is placed between wider-bandgap InP layers.

1. Introduction: InGaAs photodiodes and 1550 nm detection

A photodiode converts incident photons into an electrical current. For absorption to occur, the photon energy must be sufficient to excite an electron across the semiconductor bandgap. The photon energy at 1550 nm is approximately 0.80 eV:

\[ E_{\mathrm{ph}}=\frac{hc}{\lambda}\approx 0.80\ \mathrm{eV}. \]

Lattice-matched In0.53Ga0.47As has a room-temperature bandgap of approximately 0.74–0.75 eV, allowing it to absorb 1550 nm light. InP has a wider bandgap of approximately 1.34 eV and is therefore largely transparent at this wavelength. The InP layers can be used to form the junction and electrical contacts while the InGaAs layer acts as the optical absorber. These bandgap values are approximate reference values; the actual simulated band edges are determined by the material parameters selected in OghmaNano.

The p–i–n arrangement consists of a p-type layer, a nominally intrinsic absorber and an n-type layer. The low doping of the middle region enables much of the applied reverse bias to fall across the absorber, producing an electric field that transports photogenerated carriers towards the contacts.

2. Opening the preset simulation and understanding its structure

Begin by clicking New simulation in the File ribbon. Open the III–V / InGaAs demonstration category [CHECK THE EXACT PRESET CATEGORY], select InGaAs/InP PIN photodiode (1550 nm) [CHECK THE EXACT PRESET DISPLAY NAME], choose a destination folder and click Save. The complete device structure, optical input and electrical calculation are already configured: you do not need to build it from scratch. The following table explains the layers provided by the preset, starting from the illuminated side. Verify these nominal values against the final installed example.

New simulation dialogue showing the III–V device categories
Select the category containing the InGaAs/InP PIN photodiode preset.
Preset library with InGaAs InP PIN photodiode at 1550 nm
Choose the InGaAs/InP PIN photodiode example and save it.
OghmaNano main window displaying the PIN photodiode preset
The loaded PIN photodiode in the Device structure tab.

Once the example opens, inspect the device in the Device structure tab (??). The layer editor lets you inspect the thickness and optical material of each layer. The doping editor and electrical parameter editor allow you to inspect the electrical properties. Do not alter the preset before running it for the first time.

LayerMaterialThicknessDopingPurpose
p+InP200 nmAcceptors: 1 × 1024 m−3p-side junction/contact layer
iIn0.53Ga0.47As2.0 µmNominally undopedPhoton absorption and carrier collection
nInP200 nmDonors: 3 × 1022 m−3n-side junction layer
n+InP100 nmDonors: 1 × 1024 m−3n-side contact layer

The key electrical distinction is between the highly doped contact layers and the nominally intrinsic InGaAs absorber. The latter has no deliberately introduced doping in this example. Its electrostatic potential, carrier densities and recombination behaviour are obtained by solving the coupled semiconductor equations rather than by assigning a fixed electric field.

Set the material parameters for InP and InGaAs using the electrical material database. For an InGaAs alloy model, check the definition of the composition parameter: depending on the model, the variable x may describe the indium or the gallium fraction. The intended alloy here is In0.53Ga0.47As. Also check the electron affinity, bandgap, effective densities of states, mobilities and recombination parameters. In a heterojunction simulation these choices influence the band offsets and carrier extraction.

OghmaNano layer editor with InP and InGaAs layers
The four-layer PIN device defined in the OghmaNano layer editor.
Doping distribution through the InGaAs/InP PIN photodiode
The acceptor and donor concentrations across the device.

3. Running the preset and examining the J–V results

With the preset loaded, click the blue Run simulation button in the File ribbon, or press F9. The Terminal tab shows the progress of the optical and electrical calculations. OghmaNano first calculates the optical generation profile and then solves the device equations at the voltages in the configured J–V sweep. You can leave all parameters at their preset values for this first run.

Terminal output during the InGaAs InP PIN photodiode calculation
The terminal displays the optical calculation and electrical voltage sweep.
Output tab containing photodiode simulation results and snapshots
Use the Output tab to open the J–V curve and simulation snapshots.

At each applied voltage OghmaNano solves Poisson's equation together with the electron and hole drift–diffusion and continuity equations. The optical model supplies the spatially resolved photogeneration rate used by the electrical solver. For the underlying equations, see the drift–diffusion theory and optical transfer-matrix model. When the calculation finishes, select the Output tab and open the J–V data (typically jv.csv); the snapshots directory contains spatially resolved band and carrier profiles at successive voltages.

Start by examining the dark or illuminated J–V output, then compare the two conditions later in this tutorial. If the preset begins with illumination enabled, preserve those results before changing Light intensity (Suns) to zero and repeating the calculation in the dark.

4. Setting the 1550 nm illumination

The photodiode is illuminated with a light source centred on 1550 nm. A narrow-band spectrum is preferable to a broadband solar spectrum when examining a photodiode intended for a particular communication wavelength. We use a Gaussian laser spectrum with a nominal full width at half maximum (FWHM) of 2 nm and an integrated incident power density of 10 W m−2. If your final simulation used a different linewidth or intensity, update these values before publication.

The spectrum can be generated with the Python script described in the Optical Spectra Database documentation. Copy the resulting spectrum directory into your local optical spectra database and select it as the illumination source. Check that the light-source intensity multiplier is set as intended; multiplying the source intensity will change the incident optical power without altering its wavelength distribution.

OghmaNano must also sample the laser line adequately on its optical wavelength mesh. A mesh covering many hundreds of nanometres with only a small number of points can miss a 2 nm-wide emission peak. For a narrow laser line, select a wavelength interval and sampling density fine enough to resolve the peak and any important absorption features. Wider FP or ASE spectra may require a correspondingly wider interval.

Gaussian light-source spectrum centred at 1550 nm
A narrow-band light source centred at 1550 nm, used to illuminate the photodiode.
Optical source and wavelength mesh settings for a 1550 nm photodiode calculation
The optical illumination and wavelength-mesh settings.

5. Examining the optical generation profile

The optical properties of the two semiconductors determine where the incident photons are absorbed. At 1550 nm the wide-bandgap InP layers are expected to absorb comparatively little light, whereas the InGaAs layer produces electron–hole pairs. The spatial generation rate G(x) is the number of electron–hole pairs generated per unit volume per unit time. For a single wavelength, it can be related to the local absorbed optical power density by

\[ G(x,\lambda)=\frac{\alpha(\lambda)I(x,\lambda)}{hc/\lambda}, \]

where \(\alpha\) is the optical absorption coefficient and \(I\) is the local optical irradiance in the material. The full model evaluates the optical field through the layer stack and calculates absorption from the wavelength-dependent optical constants.

?? shows the calculated generation rate across the device. The large increase at the entrance to InGaAs and the much smaller generation in the InP regions are consistent with their differing bandgaps. The oscillations within the absorber are a consequence of interference between optical waves propagating through and reflecting within the multilayer structure. For a refractive index near 3.5, an interference feature in intensity has a characteristic spatial period of approximately \(\lambda/(2n)\), or about 220 nm at 1550 nm.

The envelope of the generation rate generally falls across the absorber as the incident light is absorbed. Its detailed shape depends on the optical constants, layer thicknesses and reflections, so it should not be interpreted as a simple exponential without considering the optical interference.

Spatially resolved optical generation rate across an illuminated InGaAs/InP PIN photodiode
Calculated optical generation rate for illumination near 1550 nm. Interference produces oscillations within the absorbing InGaAs region.

6. Energy bands at 0 V in the dark

To examine equilibrium, select the Optical ribbon, set Light intensity (Suns) to zero, rerun the preset, and open the snapshots folder from the Output tab. Use the snapshot slider to select 0 V in the dark. At thermal equilibrium the electron and hole quasi-Fermi levels coincide, forming one spatially constant Fermi level. The conduction- and valence-band edges are not flat, however, because a built-in electrostatic potential forms between the doped layers.

The bandgap is visibly smaller in InGaAs than in InP. At the InP/InGaAs interfaces, discontinuities in the conduction- and valence-band edges represent heterojunction band offsets. The precise size of each offset depends on the bandgaps and electron affinities used by the electrical material model.

Across the nominally intrinsic absorber, both band edges slope as a consequence of the built-in electric field. The field is related to the gradient of the electrostatic potential, \(F=-d\phi/dx\). Since the band edges follow that potential, an approximately linear band-edge profile indicates an approximately uniform field over that region. This field can collect photogenerated carriers even when no external voltage is applied.

Equilibrium conduction and valence band edges with a flat Fermi level at 0 V in the dark
Band diagram at 0 V in the dark. The equilibrium Fermi level is flat, while the band edges bend across the PIN junction.

7. Applying −2 V reverse bias

Restore the 1550 nm illumination, rerun the simulation, and use the snapshots viewer slider to select approximately −2 V. Photodiodes are commonly operated under reverse bias. Applying a negative voltage across the junction increases the magnitude of the electric field in the depleted absorber and drives electrons and holes towards opposite sides of the device. In this example we examine the band diagram at −2 V under illumination.

Compared with the 0 V equilibrium result, the conduction- and valence-band edges have a stronger slope across InGaAs. Under illumination the electron and hole quasi-Fermi levels need not coincide: carrier generation and extraction drive the device away from thermal equilibrium. Their spatial gradients are related to the flow of electron and hole current. Sharp changes in a quasi-Fermi level close to an interface can also indicate a significant transport resistance or extraction barrier, which should be evaluated alongside the carrier densities and current profiles.

The wider-bandgap InP regions can introduce heterojunction barriers. These do not by themselves imply poor device operation, but their magnitudes should be realistic and the simulated electron and hole currents should remain consistent through the device.

Energy-band diagram and quasi-Fermi levels for an illuminated PIN photodiode at minus 2 volts
Band diagram at −2 V under illumination. Reverse bias increases the electric field across the absorber, while electron and hole quasi-Fermi levels separate.
Calculated electric-field profile across the reverse-biased photodiode
Optional: the electric-field profile across the reverse-biased PIN device.

8. Comparing dark and illuminated J–V characteristics

Run a J–V simulation over the reverse- and low-forward-bias range. The supplied starter model was configured for a sweep from −2.0 V to +0.2 V; use the actual sweep range from your final simulation if this has changed. First run the simulation with the light source disabled to obtain the dark current, and then repeat with the 1550 nm source enabled.

The dark characteristic is expected to be strongly rectifying. At sufficiently small forward bias there is little injection current, while at larger forward bias the current can rise rapidly. Under reverse bias, an idealised drift–diffusion model may predict a very small dark current. In real InGaAs photodiodes, bulk generation–recombination, surface leakage and field-assisted processes can make the reverse dark current larger. The predicted current therefore depends on which physical loss mechanisms are included.

Under illumination, absorbed photons create electron–hole pairs. Once collection becomes efficient, the reverse-bias photocurrent should be relatively insensitive to further increases in reverse voltage. A substantial voltage dependence may instead indicate incomplete collection, recombination losses or transport barriers. The photocurrent density is obtained by subtracting the dark result from the illuminated result at the same applied voltage:

\[ J_{\mathrm{ph}}(V)=J_{\mathrm{light}}(V)-J_{\mathrm{dark}}(V). \]

The sign of \(J_{\mathrm{ph}}\) depends on the current convention. For the responsivity calculation below, we use its magnitude.

Comparison of dark and illuminated current density versus voltage for the InGaAs/InP PIN photodiode
Dark and 1550 nm illuminated J–V curves. Reverse-bias operation is used to collect the photogenerated carriers.

9. Calculating photodiode responsivity

The responsivity describes how much photocurrent is produced by a given incident optical power. Using current density \(J_{\mathrm{ph}}\) and incident power density \(P_{\mathrm{in}}\), the responsivity is

\[ R(\lambda)=\frac{|J_{\mathrm{ph}}|}{P_{\mathrm{in}}}\qquad [\mathrm{A/W}]. \]

Here \(P_{\mathrm{in}}\) is the incident optical power per unit device area, not the absorbed power. Consequently, the calculated responsivity includes reflection and incomplete absorption as well as electrical collection losses. At a single wavelength, the maximum external responsivity corresponding to one collected electron per incident photon is

\[ R_{\mathrm{ideal}}=\frac{q\lambda}{hc}\approx 1.25\ \mathrm{A/W}\quad \text{at }1550\ \mathrm{nm}. \]

For example, with an incident irradiance of 10 W m−2 and an actual responsivity of 1.0 A/W, the expected photocurrent density is 10 A m−2, equivalent to 1.0 mA cm−2. This is an illustration, not a measured result from this simulation.

Insert the final simulation results: at −2 V, the dark current density is [DARK_J] A m−2, the illuminated current density is [LIGHT_J] A m−2, and the resulting responsivity is [RESPONSIVITY] A/W. Use the actual incident irradiance, including any source multiplier, when calculating this value.

There is a second useful consistency check. Integrating the optical generation rate through the device gives the maximum current density that could be collected if every generated electron–hole pair contributed to the current:

\[ |J_{\mathrm{gen}}|=q\int G(x)\,dx. \]

Compare \(|J_{\mathrm{gen}}|\) with the simulated photocurrent under sufficient reverse bias. A smaller extracted current can indicate recombination or incomplete extraction, although the comparison also requires consistent optical and electrical geometries and the same incident illumination.

10. Further investigations

Once the reference photodiode is working, changing one parameter at a time can help identify which parts of the device control its response.

Experiment 1: Change the absorber thickness. Increase and decrease the InGaAs thickness while keeping the optical input unchanged. What happens to the generation profile and reverse-bias photocurrent?

Show explanation

A thicker absorber can capture a larger fraction of the incoming light, but the optical interference pattern and carrier-collection properties also change. The photocurrent need not grow in direct proportion to thickness.

Experiment 2: Change the reverse bias. Compare the electric-field profile and photocurrent at 0 V, −0.5 V and −2 V.

Show explanation

Reverse bias usually increases the field across the absorber and improves carrier extraction. Once the collection efficiency is close to unity, additional reverse bias may produce little extra photocurrent.

Experiment 3: Change the illumination wavelength. Compare the device response near 1550 nm with a longer wavelength approaching the InGaAs absorption edge.

Show explanation

As the photon energy approaches the bandgap, the absorption coefficient generally falls and photons penetrate farther into the device. The resulting responsivity depends on how much light is absorbed and how efficiently the generated carriers are collected.

Experiment 4: Examine interface transport. Change the electrical band alignment within a physically reasonable range and inspect the electron and hole quasi-Fermi levels near each InP/InGaAs interface.

Show explanation

The conduction- and valence-band offsets influence carrier transport across the heterojunctions. A large extraction barrier can cause carrier accumulation and additional voltage loss, even when optical absorption is strong.

11. Summary and what you have learned

This tutorial has demonstrated how OghmaNano can combine an optical transfer-matrix calculation with drift–diffusion transport to model an InGaAs/InP PIN photodiode. The wide-bandgap InP layers allow 1550 nm light to reach the InGaAs absorber, optical interference shapes the spatial generation profile, and the junction field separates and collects photogenerated carriers. By comparing dark and illuminated J–V curves, the photocurrent and responsivity can be obtained from the same device model.

For information about importing and generating custom laser spectra, see the Optical Spectra Database documentation.